通富微电子股份有限公司-通富微电子股份有限公司

产品技巧

Products

封装品种

您当前地位:520彩票首页|产品技巧|封装品种

 
DIP series

Production Overview

 

   DIPDual-In-line packages have been an industry standard for a long time。 The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers。 These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance。 Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs。

 

Key Features

 


 PKG TYPE

DIP300mil

DIP400mil

DIP600mil

DIP750mil520彩票首页

Lead Count

8~24

28/32

24/28/42/48/52520彩票首页

64/88520彩票首页

LF Material

Cu520彩票首页

Cu

Cu520彩票首页

Cu

Body Width

(mm) * (mm)

7.62

10.16

15.24

19.05/19.50

Body Thickness

3.30

3。30/3。80

3.81

3.80

Lead pitch (mm)

2。54/1。778

1.778

2.54/1.778

1.778/1.27


(1mm=39.37mil; 1mil=25.4um)
* The width of DIP is the distance of shoulder-to-shoulder.


 

Reliability Test Standards

The test criterion is zero defect out of 77 sampling units.


Temp/Humidity Test

85°C/ 85% RH,  JEDEC 22- A101

Pressure Cooker Test520彩票首页

121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102520彩票首页

Temp Cycle Test

-65 ~ 150°C, JEDEC22-A104

High Temp Storage Test

150°C, JEDEC 22- A103

High Accelerated Stress Test520彩票首页

130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118

520彩票首页


 

 



CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
地址:江苏省南通市崇川路288号 电 话:0513-85058888 传 真:0513-85058868
备案号:

520彩票开奖网 39彩票计划 520彩票怎么买 520彩票平台欢迎您 39彩票开奖直播 39彩票玩法 520彩票投注 39彩票开户 520彩票平台官网 520彩票官网